Monday, September 12, 2011

The Secret to Making Processors 1,000 Times Faster is ... Glue

The secret here is how well the glue dissipates the heat. That heat dissipation allows for stacks of chips 100 high effectively increasing computing times 1,000.

Video embedded below.

"This is not just any glue. It’s an adhesive that dissipates heat so efficiently that layer upon layer of chips can be stacked on top of each other into silicon “towers” up to 100 layers high, glued together with this special adhesive that keeps things cool. The result? Faster chips for computers, laptops, smartphones and anything else that uses microprocessors.

With IBM supplying its microprocessor and silicon expertise and 3M contributing its super-cool adhesive, the two companies aim to stack together processors, memory chips and networks into monster “skyscrapers” of silicon they say will be 1,000 times faster than today’s fastest processor.

When can we get our hands on this breakthrough tech? IBM’s media relations representative Michael Corrado tells us, “By the end of 2013 it should go into production. It’ll show up on servers first, and then a year after that consumers might see it.”

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